High-throughput test platform for adhesion toughness of pressure sensitive adhesives

Technology
Conceptual
University

A novel high-throughput platform for assessing adhesion toughness of pressure sensitive adhesives using a 180-degree peeling test. This method allows simultaneous testing of multiple samples, enabling efficient characterization of adhesion properties.

Overview

This innovative platform offers a high-throughput method to characterize the adhesion toughness of pressure sensitive adhesives (PSAs) through a modified 180-degree peeling test. By employing a linear motor and force sensors, this system enables the simultaneous testing of multiple samples, streamlining the process of assessing adhesion properties. This approach allows for the direct calculation of adhesion toughness from force-displacement data without the need for specific constitutive models, making it applicable to a wide range of adhesive materials.

Technical specifications

Key features:

  • Simultaneous testing of multiple adhesive samples under uniform displacement conditions.
  • Direct measurement of adhesion toughness from force-displacement curves.
  • Adaptable to various adhesive thicknesses and materials.
  • Potential to extend testing to include temperature, thickness, and rate dependence.
  • Developed using extensive expertise in fracture mechanics and finite element modeling.
Technology readiness level

The platform is currently at Technology Readiness Level 3, indicating experimental proof of concept. Further validation and collaboration with industry partners are sought to refine the testing framework and extend its applications to specific needs, such as flexible or stretchable substrates.


About Northeastern University

Northeastern University is a private, comprehensive R1 research university based in Boston with a global campus network. Its century-old cooperative education model integrates full-time, paid placements with academic study, enabling companies to access vetted talent and long-term pipelines worldwide. Industry collaboration is supported by a suburban innovation campus offering test beds, secure labs, and fee-for-use core facilities, alongside co-located partner spaces. The university attracts competitive federal research funding from agencies such as the NSF and NIH. A dedicated technology transfer office streamlines IP, licensing, and startup formation for corporate partnerships.

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