Electro and aerohydrodynamic encapsulation processes for biological preservation
Advanced encapsulation techniques using electrospraying and solution blow spraying offer a unique approach to protect biologicals without high temperatures, preserving their activity. Ideal for applications requiring sensitive biomolecule preservation.
Overview
Electrohydrodynamic and aerohydrodynamic encapsulation processes, specifically electrospraying (ES) and solution blow spraying (SBSp), present a revolutionary approach to protecting biologicals. By eliminating the need for high temperatures during encapsulation, these methods preserve the integrity and activity of sensitive biomolecules. This technology is particularly beneficial for applications in pharmaceuticals, biotechnology, and agriculture where the preservation of biological activity is crucial.
Technical specifications
Key features:
- Electrospraying (ES): Utilizes high voltage to form a Taylor cone, allowing solvent evaporation without heat, suitable for high encapsulation yields.
- Solution Blow Spraying (SBSp): Uses high-velocity airflow at ambient temperature to form capsules, minimizing thermal and mechanical stress on biomolecules.
- Biopolymer selection: Critical for achieving high encapsulation efficiency and biological activity preservation.
The process involves optimizing variables such as voltage, polymer concentration, and nozzle design to tailor encapsulation performance to specific biologicals and their intended applications.
Technology readiness level
This encapsulation technology is at Technology Readiness Level 6, indicating that it has been validated in relevant environments and is approaching commercialization. Future validation efforts will focus on optimizing biopolymer selection and process parameters to ensure maximal efficacy and stability of the encapsulated products.
About Tecnológico Nacional de México
Tecnológico Nacional de México is a national public system of technological institutes operating across the country, combining large‑scale engineering education with applied research. Industry engagement is embedded through a for‑credit professional residency required for undergraduates, placing students in companies to deliver scoped projects under joint academic and external supervision. Campuses maintain Technology Management and Industry Liaison offices that broker collaborations, and a multi‑campus incubation network supports venture creation and early prototyping. Projects are funded through competitive programs administered by TecNM and external sponsors. Technology transfer and IP support through liaison offices and incubators streamline sponsored research and commercialization.
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