Lignin-based photoresist platform for sub-20 nm EUV lithography

Overview

Barracuda Technologies Inc. is pioneering a novel photoresist platform using functionalized lignin derivatives for next-generation semiconductor manufacturing. This innovative solution addresses the critical bottlenecks in current chemically amplified resists (CARs) by enhancing EUV photon capture through lignin’s aromatic structure. The proposed platform promises superior performance in high-volume manufacturing (HVM) at the 5 nm node and beyond, with exceptional plasma etch selectivity and reduced material thickness, all while being sustainable and cost-effective.

Technical specifications

Key features:

• High EUV Absorption: Lignin's aromatic structure significantly improves EUV photon capture compared to standard non-aromatic polymers.
• Superior Etch Resistance: High carbon content and aromaticity enable exceptional plasma etch selectivity, allowing for thinner resist films and higher resolution.
• Sustainability: Sourced from biomass, lignin is an abundant and low-cost raw material, reducing reliance on petroleum-based polymers.

Development Plan:

• Phase 1 (0-6 Months): Optimization of lignin functionalization and PAG formulation to achieve sensitivity <25 mJ/cm² at an initial 30 nm half-pitch.
• Phase 2 (7-12 Months): Demonstrate 12 nm half-pitch patterning with EBL to confirm material resolution and optimize for low line-edge roughness (LER) <2.0 nm.
• Phase 3 (13-18 Months): Scale material synthesis to kilogram quantities, initiate alpha testing with industry partners, and validate on EUV lithography tools.

Technology readiness level

The technology is currently at TRL 3, with initial functionalization processes underway and plans for further validation and scaling through a structured development timeline.