Advanced laser joining and additive manufacturing solutions that reduce production energy consumption and minimize waste from out-of-spec parts. Offers energy-efficient alternatives to legacy laser systems, with capabilities in wear-resistant cladding, integrated cooling channels, and in-process monitoring for packaging production lines.
This solution offers energy-efficient laser processing technologies designed to reduce production energy consumption and physical waste in packaging manufacturing. By replacing legacy laser systems (such as CO2 and Nd:YAG, which can be as low as 5% efficient) with modern diode and fiber lasers achieving 60 to 70% wall plug efficiency, manufacturers can significantly lower energy costs. These advanced lasers can be tuned to maximize energy absorption for specific packaging materials, while delivering high repeatability and accuracy. The technology also enables new processing capabilities not possible with traditional methods, including wear-resistant cladding and additive manufacturing of dies with integrated cooling channels.
Key capabilities and features:
Workforce development differentiator:
The lab is actively training laser process engineers and collaborating with trade schools to build the future workforce pipeline, addressing the mass retirement of the current on-the-job trained workforce.
The proposed engagement begins with travel to the partner's production facilities to identify major production pain points, followed by a five-month experimental proof-of-concept phase with regular virtual update meetings, and concludes with delivery of a prototype, report, and presentation. This staged approach allows validation of the technology against real production challenges before scaling.
The Ohio State University is a comprehensive public land‑grant research university in Columbus, serving one of the nation’s largest student populations and a broad research enterprise. Industry partners engage through an integrated academic medical center for clinical translation, a campus‑adjacent innovation district for co‑located projects, and a statewide extension network that pilots solutions across Ohio. Corporate engagement provides a single front door for sponsored research, talent pipelines, and streamlined agreements. Research is supported by competitive federal funding from agencies such as NIH, NSF, DOE, USDA, DoD, and NASA. A dedicated technology transfer office and venture support help protect IP, license technologies, and launch startups.