Innovative hyperspectral imaging technology for precise measurement and inspection of thin-film coatings, addressing defects such as non-uniform thickness and voids to prevent equipment downtime and financial loss.
Spectromicroscopy utilizing UV light absorption for inspecting TPO bonding layers to identify air voids and assess layer conditions with high precision and resolution.
Advanced in-process force and pressure measurement solution using piezoelectric transducers to enhance metal-forming process control and part quality. Enables real-time diagnostics and AI-based prognostics for high-speed...